Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264313 | Semiconductor device and method for manufacturing same | Akito Shimizu, Yasuhisa Shintoku, Hiroaki Kishi, Atsushi Hosokawa, Tomohiko Imada +1 more | 2022-03-01 |
| 10840166 | Semiconductor device | Kumiko Karouji, Morihiko Ikemizu, Hiroaki Kishi, Tomohiko Imada, Akito Shimizu | 2020-11-17 |
| 10790219 | Semiconductor package and method of manufacturing the same | Kenji Yamada | 2020-09-29 |
| 10340207 | Semiconductor package and method of manufacturing the same | Kenji Yamada | 2019-07-02 |
| 9887311 | Semiconductor module having a light-transmissive insulating body | Tetsuya Kurosawa | 2018-02-06 |
| 8338904 | Semiconductor device and method for manufacturing the same | Kazumasa Tanida, Chiaki Takubo, Hideo Numata | 2012-12-25 |
| 8084499 | Modified clay mineral | Souichirou Ootake, Tetsuya Izumi | 2011-12-27 |
| 7880301 | Semiconductor device and method for manufacturing the same | — | 2011-02-01 |
| 7638858 | Semiconductor device and manufacturing method thereof | Tetsuya Kurosawa | 2009-12-29 |
| 7608911 | Semiconductor device package having a semiconductor element with a roughened surface | Takashi Imoto, Chiaki Takubo, Ryuji Hosokawa, Takao Sato, Tetsuya Kurosawa +1 more | 2009-10-27 |
| 7405159 | Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface | Takashi Imoto, Chiaki Takubo, Ryuji Hosokawa, Takao Sato, Tetsuya Kurosawa +1 more | 2008-07-29 |
| 7217640 | Semiconductor device and manufacturing method thereof | Tetsuya Kurosawa | 2007-05-15 |
| 7202563 | Semiconductor device package having a semiconductor element with resin | Takashi Imoto, Chiaki Takubo, Ryuji Hosokawa, Takao Sato, Tetsuya Kurosawa +1 more | 2007-04-10 |
| 5397453 | Semiconductor product plating apparatus | — | 1995-03-14 |