TI

Takashi Imoto

KT Kabushiki Kaisha Toshiba: 17 patents #1,748 of 21,451Top 9%
Canon: 4 patents #10,118 of 19,416Top 55%
ND Nitto Denko: 2 patents #1,207 of 2,479Top 50%
Toshiba Memory: 2 patents #853 of 1,971Top 45%
Kioxia: 1 patents #1,054 of 1,813Top 60%
IC Ibiden Co.: 1 patents #451 of 730Top 65%
EX Exedy: 1 patents #143 of 223Top 65%
📍 Kamakura, JP: #52 of 1,212 inventorsTop 5%
Overall (All Time): #144,417 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 1–25 of 27 patents

Patent #TitleCo-InventorsDate
11715701 Semiconductor device and method of inspecting the same Yuusuke Takano, Yoshiaki Goto, Takeshi Watanabe 2023-08-01
11545869 Motor having frame with axial vent hole Yoshifumi Shimogaki 2023-01-03
10799156 Sheet for identification Akinori Nishio 2020-10-13
10312197 Method of manufacturing semiconductor device and semiconductor device Yuusuke Takano, Takeshi Watanabe, Soichi Homma, Katsunori Shibuya 2019-06-04
9824905 Semiconductor manufacturing device and semiconductor manufacturing method Katsunori Shibuya, Soichi Homma, Takeshi Watanabe, Yuusuke Takano 2017-11-21
9458535 Semiconductor manufacturing device and semiconductor manufacturing method Katsunori Shibuya, Soichi Homma, Takeshi Watanabe, Yuusuke Takano 2016-10-04
9385090 Semiconductor device and method of manufacturing semiconductor device Katsunori Shibuya, Soichi Homma, Takeshi Watanabe, Yuusuke Takano 2016-07-05
9207889 Information processing apparatus, information processing method, and storage medium 2015-12-08
9209053 Manufacturing method of a conductive shield layer in semiconductor device Yoshiaki Goto, Takeshi Watanabe, Yuusuke Takano, Yusuke Akada, Yuji Karakane +2 more 2015-12-08
8896111 Semiconductor device and method for manufacturing the same Akira Tanimoto, Yoriyasu Ando, Masashi Noda, Naoki Iwamasa, Koichi Miyashita +4 more 2014-11-25
8237295 Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device Yuichi Sano, Naoto Takebe, Katsuhiro Ishida, Tomomi Honda, Yasushi Kumagai 2012-08-07
7932605 Semiconductor device and manufacturing method therefor Chiaki Takubo 2011-04-26
7682692 Pressure-sensitive adhesive product Tsuneyuki Amano 2010-03-23
7608911 Semiconductor device package having a semiconductor element with a roughened surface Chiaki Takubo, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato, Tetsuya Kurosawa +1 more 2009-10-27
7497535 Print control apparatus, print control method thereof, control program, printer driver, printer, and computer readable storage medium 2009-03-03
7423772 Information processing apparatus, job processing method and program, and computer-readable memory medium Hideki Honda 2008-09-09
7405159 Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface Chiaki Takubo, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato, Tetsuya Kurosawa +1 more 2008-07-29
7352052 Semiconductor device and manufacturing method therefor Chiaki Takubo 2008-04-01
7298035 Semiconductor device and a method of assembling a semiconductor device Ryuji Hosokawa 2007-11-20
7255493 Optical semiconductor module and its manufacturing method Hiroshi Hamasaki, Hideto Furuyama, Hideo Numata 2007-08-14
7202563 Semiconductor device package having a semiconductor element with resin Chiaki Takubo, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato, Tetsuya Kurosawa +1 more 2007-04-10
7158243 Printing apparatus and printing system, control method, storage medium and program Kazuya Sakamoto, Takayuki Fujita, Tsutomu Takahashi, Mikio Shiga, Hiroshi Maruoka +6 more 2007-01-02
7118294 Optical semiconductor module and its manufacturing method Hiroshi Hamasaki, Hideto Furuyama, Hideo Numata 2006-10-10
6861738 Laminated-chip semiconductor device Katsuhiko Oyama, Mitsuyoshi Endo, Chiaki Takubo, Takashi Yamazaki 2005-03-01
6734541 Semiconductor laminated module Hiroshi Shimoe, Naohisa Okumura, Ryuji Hosokawa 2004-05-11