Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8759971 | Semiconductor apparatus | Tsutomu Kojima, Tatsuo Shiotsuki | 2014-06-24 |
| 7608911 | Semiconductor device package having a semiconductor element with a roughened surface | Takashi Imoto, Chiaki Takubo, Yoshihisa Imori, Takao Sato, Tetsuya Kurosawa +1 more | 2009-10-27 |
| 7405159 | Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface | Takashi Imoto, Chiaki Takubo, Yoshihisa Imori, Takao Sato, Tetsuya Kurosawa +1 more | 2008-07-29 |
| 7298035 | Semiconductor device and a method of assembling a semiconductor device | Takashi Imoto | 2007-11-20 |
| 7202563 | Semiconductor device package having a semiconductor element with resin | Takashi Imoto, Chiaki Takubo, Yoshihisa Imori, Takao Sato, Tetsuya Kurosawa +1 more | 2007-04-10 |
| 6734541 | Semiconductor laminated module | Hiroshi Shimoe, Naohisa Okumura, Takashi Imoto | 2004-05-11 |
| 5614441 | Process of folding a strip leadframe to superpose two leadframes in a plural semiconductor die encapsulated package | Satoru Yanagida | 1997-03-25 |
| 5543658 | Method of manufacturing resin-sealed semiconductor device, lead frame used in this method for mounting plurality of semiconductor elements, and resin-sealed semiconductor device | Satoru Yanagida | 1996-08-06 |