Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5614441 | Process of folding a strip leadframe to superpose two leadframes in a plural semiconductor die encapsulated package | Ryuji Hosokawa | 1997-03-25 |
| 5543658 | Method of manufacturing resin-sealed semiconductor device, lead frame used in this method for mounting plurality of semiconductor elements, and resin-sealed semiconductor device | Ryuji Hosokawa | 1996-08-06 |
| 5113241 | Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles | Kouji Araki, Hikaru Okunoyama, Tetsunori Niimi | 1992-05-12 |