Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11993057 | Film to hold a metal layer, metallic decorative sheet intermediate product, metallic decorative sheet, extruded laminate product, metallic molded product, injection molded product, method for producing a metallic molded product, method for producing injection molded product, and method for producing an extruded laminate product | Chikatsu Akisada, Ryuta Takeuchi | 2024-05-28 |
| 11749667 | Semiconductor manufacturing apparatus | Toshihiko Ohda, Masatoshi Fukuda | 2023-09-05 |
| 11521950 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device | — | 2022-12-06 |
| 11024619 | Semiconductor manufacturing apparatus | Toshihiko Ohda, Masatoshi Fukuda | 2021-06-01 |
| 10490531 | Manufacturing method of semiconductor device and semiconductor device | Takanobu Ono | 2019-11-26 |
| 10490485 | Semiconductor device | Naohisa Okumura, Yasuhisa Shintoku, Hiroaki Kishi | 2019-11-26 |
| 10026677 | Semiconductor device | Naohisa Okumura, Yasuhisa Shintoku, Hiroaki Kishi | 2018-07-17 |
| 9887311 | Semiconductor module having a light-transmissive insulating body | Yoshihisa Imori | 2018-02-06 |
| 8956917 | Semiconductor device, and manufacturing method and manufacturing apparatus of the same | Shinya Takyu, Akira Tomono | 2015-02-17 |
| 8294282 | Semiconductor device and adhesive sheet | Hidekazu Hayashi, Hiroshi Tomita, Junya Sagara, Shinya Takyu, Norihiro Togasaki +1 more | 2012-10-23 |
| 7932162 | Method for manufacturing a stacked semiconductor package, and stacked semiconductor package | Junya Sagara, Shinya Takyu | 2011-04-26 |
| 7892890 | Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof | Junya Sagara | 2011-02-22 |
| 7675153 | Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof | Junya Sagara | 2010-03-09 |
| 7642113 | Semiconductor wafer dividing method | — | 2010-01-05 |
| 7638858 | Semiconductor device and manufacturing method thereof | Yoshihisa Imori | 2009-12-29 |
| 7631680 | Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer | Shinya Takyu | 2009-12-15 |
| 7608911 | Semiconductor device package having a semiconductor element with a roughened surface | Takashi Imoto, Chiaki Takubo, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato +1 more | 2009-10-27 |
| 7405159 | Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface | Takashi Imoto, Chiaki Takubo, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato +1 more | 2008-07-29 |
| 7300818 | Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer | Shinya Takyu | 2007-11-27 |
| 7294558 | Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid | Noriko Shimizu, Shinya Takyu | 2007-11-13 |
| 7223319 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device | Shinya Takyu, Kinya Mochida, Kenichi Watanabe | 2007-05-29 |
| 7217640 | Semiconductor device and manufacturing method thereof | Yoshihisa Imori | 2007-05-15 |
| 7202563 | Semiconductor device package having a semiconductor element with resin | Takashi Imoto, Chiaki Takubo, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato +1 more | 2007-04-10 |
| 7172673 | Peeling device and peeling method | Masahisa Otsuka | 2007-02-06 |
| 7140951 | Semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor wafer | — | 2006-11-28 |