Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8294282 | Semiconductor device and adhesive sheet | Hidekazu Hayashi, Hiroshi Tomita, Shinya Takyu, Norihiro Togasaki, Tetsuya Kurosawa +1 more | 2012-10-23 |
| 8231046 | Wire bonding apparatus and wire bonding method | Mitsuhiro Nakao, Katsuhiro Ishida, Noboru Okane | 2012-07-31 |
| 7932162 | Method for manufacturing a stacked semiconductor package, and stacked semiconductor package | Shinya Takyu, Tetsuya Kurosawa | 2011-04-26 |
| 7892890 | Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof | Tetsuya Kurosawa | 2011-02-22 |
| 7849897 | Apparatus and method for manufacturing semiconductor device | Shoko Omizo, Atsushi Yoshimura, Mitsuhiro Nakao, Masayuki Dohi, Tatsuhiko Shirakawa | 2010-12-14 |
| 7675153 | Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof | Tetsuya Kurosawa | 2010-03-09 |
| 7569921 | Semiconductor device and manufacturing method thereof | Noboru Okane, Ryoji Matsushima, Kazuhiro Yamamori, Yoshio Iizuka, Kuniyuki Ohnishi | 2009-08-04 |