Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9893116 | Manufacturing method of electronic device and manufacturing method of semiconductor device | Hideo Numata, Hiroyuki Okura | 2018-02-13 |
| 8956917 | Semiconductor device, and manufacturing method and manufacturing apparatus of the same | Tetsuya Kurosawa, Akira Tomono | 2015-02-17 |
| 8790995 | Processing method and processing device of semiconductor wafer, and semiconductor wafer | Noriko Shimizu, Tsutomu Fujita | 2014-07-29 |
| 8771456 | Method of manufacturing a semiconductor device and substrate separating apparatus | Noriko Shimizu | 2014-07-08 |
| 8294282 | Semiconductor device and adhesive sheet | Hidekazu Hayashi, Hiroshi Tomita, Junya Sagara, Norihiro Togasaki, Tetsuya Kurosawa +1 more | 2012-10-23 |
| 7932162 | Method for manufacturing a stacked semiconductor package, and stacked semiconductor package | Junya Sagara, Tetsuya Kurosawa | 2011-04-26 |
| 7833836 | Stack MCP and manufacturing method thereof | Kazuhiro Iizuka, Mika Kiritani | 2010-11-16 |
| 7631680 | Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer | Tetsuya Kurosawa | 2009-12-15 |
| 7482695 | Stack MCP and manufacturing method thereof | Kazuhiro Iizuka, Mika Kiritani | 2009-01-27 |
| 7300818 | Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer | Tetsuya Kurosawa | 2007-11-27 |
| 7294558 | Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid | Noriko Shimizu, Tetsuya Kurosawa | 2007-11-13 |
| 7285864 | Stack MCP | Kazuhiro Iizuka, Mika Kiritani | 2007-10-23 |
| 7223319 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device | Tetsuya Kurosawa, Kinya Mochida, Kenichi Watanabe | 2007-05-29 |
| 7135384 | Semiconductor wafer dividing method and apparatus | Ninao Sato | 2006-11-14 |
| 7060532 | Manufacturing method of semiconductor device | Tetsuya Kurosawa, Kinya Mochida, Kenichi Watanabe | 2006-06-13 |
| 7060593 | Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer | Tetsuya Kurosawa | 2006-06-13 |
| 6838316 | Semiconductor device manufacturing method using ultrasonic flip chip bonding technique | Kazuhiro Iizuka | 2005-01-04 |
| 6777313 | Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time | Mika Kiritani, Tetsuya Kurosawa, Terunari Takano | 2004-08-17 |
| 6774011 | Chip pickup device and method of manufacturing semiconductor device | Takahito Nakazawa, Tetsuya Kurosawa, Hideo Numata | 2004-08-10 |
| 6756562 | Semiconductor wafer dividing apparatus and semiconductor device manufacturing method | Tetsuya Kurosawa, Ninao Sato | 2004-06-29 |
| 6699774 | Wafer splitting method using cleavage | Tetsuya Kurosawa | 2004-03-02 |
| 6465330 | Method for grinding a wafer back | Kazuhiro Takahashi, Kazuyoshi Ebe | 2002-10-15 |
| 6337258 | Method of dividing a wafer | Hideo Nakayoshi, Keisuke Tokubuchi, Tetsuya Kurosawa | 2002-01-08 |
| 6294439 | Method of dividing a wafer and method of manufacturing a semiconductor device | Shigeo Sasaki, Keisuke Tokubuchi, Koichi Yazima, Hideo Nakayoshi | 2001-09-25 |
| 6184109 | Method of dividing a wafer and method of manufacturing a semiconductor device | Shigeo Sasaki, Keisuke Tokubuchi, Koichi Yazima, Hideo Nakayoshi | 2001-02-06 |