Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11919084 | Electronic component and method for manufacturing the same | Keita MUNEUCHI, Eiji ISO, Isao IDA, Kenichi Araki, Takashi Tomohiro | 2024-03-05 |
| 11705271 | Coil component | Gota Shinohara, Mikito Sugiyama, Mari Yonemura | 2023-07-18 |
| 11615903 | Coil component and method of manufacturing the coil component | Takashi Tomohiro, Kenichi Araki, Eiji ISO, Keita MUNEUCHI, Isao IDA | 2023-03-28 |
| 11569022 | Coil component | Gota Shinohara, Mikito Sugiyama, Mari Yonemura | 2023-01-31 |
| 11488760 | Electronic component and method for manufacturing the same | Keita MUNEUCHI, Eiji ISO, Isao IDA, Kenichi Araki, Takashi Tomohiro | 2022-11-01 |
| 11276519 | Coil component | Gota Shinohara, Keiichi Ishida, Hironobu KUBOTA, Mari Yonemura, Takao Kawachi | 2022-03-15 |
| 10872720 | Electronic component | Kenichi Araki | 2020-12-22 |
| 10340072 | Electronic component and method of manufacturing the same | Masaki Kitajima, Takashi Tomohiro, Gota Shinohara, Hironori Suzuki | 2019-07-02 |
| 9535136 | Magnetic field probe | Takashi Ichimura, Takahiro Azuma | 2017-01-03 |
| 9478354 | Inductor manufacturing method | Hironori Suzuki, Yasushi Takeda, Yoichi Nakatsuji, Gota Shinohara, Junji Kurobe +1 more | 2016-10-25 |
| 8790995 | Processing method and processing device of semiconductor wafer, and semiconductor wafer | Shinya Takyu, Tsutomu Fujita | 2014-07-29 |
| 8771456 | Method of manufacturing a semiconductor device and substrate separating apparatus | Shinya Takyu | 2014-07-08 |
| 7294558 | Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid | Shinya Takyu, Tetsuya Kurosawa | 2007-11-13 |