Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777313 | Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time | Shinya Takyu, Mika Kiritani, Tetsuya Kurosawa | 2004-08-17 |
| 6545348 | Package for a semiconductor device comprising a plurality of interconnection patterns around a semiconductor chip | — | 2003-04-08 |
| 6326243 | Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin | Nobuhito Suzuya, Morihiko Ikemizu, Kenji Uehara, Akito Yoshida | 2001-12-04 |
| 5753969 | Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin | Nobuhito Suzuya, Morihiko Ikemizu, Kenji Uehara, Akito Yoshida | 1998-05-19 |