Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7833836 | Stack MCP and manufacturing method thereof | Shinya Takyu, Kazuhiro Iizuka | 2010-11-16 |
| 7608911 | Semiconductor device package having a semiconductor element with a roughened surface | Takashi Imoto, Chiaki Takubo, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato +1 more | 2009-10-27 |
| 7482695 | Stack MCP and manufacturing method thereof | Shinya Takyu, Kazuhiro Iizuka | 2009-01-27 |
| 7405159 | Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface | Takashi Imoto, Chiaki Takubo, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato +1 more | 2008-07-29 |
| 7285864 | Stack MCP | Shinya Takyu, Kazuhiro Iizuka | 2007-10-23 |
| 7202563 | Semiconductor device package having a semiconductor element with resin | Takashi Imoto, Chiaki Takubo, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato +1 more | 2007-04-10 |
| 6787093 | Semiconductor resin molding method | — | 2004-09-07 |
| 6777313 | Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time | Shinya Takyu, Tetsuya Kurosawa, Terunari Takano | 2004-08-17 |