Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840166 | Semiconductor device | Kumiko Karouji, Yoshihisa Imori, Hiroaki Kishi, Tomohiko Imada, Akito Shimizu | 2020-11-17 |
| 6495922 | Semiconductor device with pointed bumps | Tetsuya Yokoi | 2002-12-17 |
| 6326243 | Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin | Nobuhito Suzuya, Terunari Takano, Kenji Uehara, Akito Yoshida | 2001-12-04 |
| 6097085 | Electronic device and semiconductor package | Nobuaki Oie, Ken Iwasaki | 2000-08-01 |
| 5892277 | Tab tape and semiconductor device using the tab tape | Takayuki Okutomo, Yutaka Fukuoka, Masafumi Takeuchi | 1999-04-06 |
| 5753969 | Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin | Nobuhito Suzuya, Terunari Takano, Kenji Uehara, Akito Yoshida | 1998-05-19 |
| 5659198 | TCP type semiconductor device capable of preventing crosstalk | Takayuki Okutomo | 1997-08-19 |
| 5652184 | Method of manufacturing a thin semiconductor package having many pins and likely to dissipate heat | Masao Goto | 1997-07-29 |
| 5612259 | Method for manufacturing a semiconductor device wherein a semiconductor chip is mounted on a lead frame | Takayuki Okutomo | 1997-03-18 |
| 5442232 | Thin semiconductor package having many pins and likely to dissipate heat | Masao Goto | 1995-08-15 |
| 5359222 | TCP type semiconductor device capable of preventing crosstalk | Takayuki Okutomo | 1994-10-25 |