Issued Patents All Time
Showing 26–26 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5888883 | Method of dividing a wafer and method of manufacturing a semiconductor device | Shigeo Sasaki, Keisuke Tokubuchi, Koichi Yazima | 1999-03-30 |
ST
Shinya Takyu
Kabushiki Kaisha Toshiba: 25 patents #1,086 of 21,451Top 6%
Lintec: 3 patents #147 of 514Top 30%
Overall (All Time): #154,668 of 4,157,543Top 4%
26
Patents All Time