Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977024 | Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies | Osamu Yamazaki | 2005-12-20 |
| 6911720 | Semiconductor device adhesive sheet with conductor bodies buried therein | Osamu Yamazaki | 2005-06-28 |
| 6900550 | Semiconductor device including adhesive agent layer with embedded conductor bodies | Osamu Yamazaki | 2005-05-31 |
| 6855418 | Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same | Osamu Yamazaki, Hideo Senoo | 2005-02-15 |
| 6723619 | Pressure sensitive adhesive sheet for semiconductor wafer processing | Koichi Nagamoto | 2004-04-20 |
| 6718223 | Method of processing semiconductor wafer and semiconductor wafer supporting member | Yuichi Iwakata, Hayato Noguchi, Katsuhisa Taguchi | 2004-04-06 |
| 6702910 | Process for producing a chip | Hayato Noguchi | 2004-03-09 |
| 6465330 | Method for grinding a wafer back | Kazuhiro Takahashi, Shinya Takyu | 2002-10-15 |
| 6436795 | Process for producing semiconductor chip | Hayato Noguchi | 2002-08-20 |
| 6398892 | Method of using pressure sensitive adhesive double coated sheet | Hayato Noguchi, Yoshihisa Mineura | 2002-06-04 |
| 6312800 | Pressure sensitive adhesive sheet for producing a chip | Hayato Noguchi | 2001-11-06 |
| 6297076 | Process for preparing a semiconductor wafer | Masazumi Amagai, Hideo Senoo | 2001-10-02 |
| 6225194 | Process for producing chip and pressure sensitive adhesive sheet for said process | Hayato Noguchi, Yoshihisa Mineura, Hideki Numazawa | 2001-05-01 |
| 6171672 | Cover tape for chip transportation and sealed structure | Hiroshi Koike, Katsuhisa Taguchi | 2001-01-09 |
| 6156423 | Base material and adhesive tape using the same | Kouichi Nagamoto, Takeshi Kondoh, Kazuhiro Takahashi, Katsuhisa Taguchi | 2000-12-05 |
| 6139953 | Adhesive tape, base material for adhesive tape and their manufacturing methods | Kouichi Nagamoto, Mikio Komiyama | 2000-10-31 |
| 6007920 | Wafer dicing/bonding sheet and process for producing semiconductor device | Norito Umehara, Masazumi Amagai, Mamoru Kobayashi | 1999-12-28 |
| 5976691 | Process for producing chip and pressure sensitive adhesive sheet for said process | Hayato Noguchi, Yoshihisa Mineura, Hideki Numazawa | 1999-11-02 |
| 5882956 | Process for producing semiconductor device | Norito Umehara, Masazumi Amagai, Mamoru Kobayashi | 1999-03-16 |
| 5356949 | Adhesive composition comprising (meth)acrylate polymer and epoxy resin | Mikio Komiyama, Yasunao Miyazawa, Takanori Saito | 1994-10-18 |
| 5187007 | Adhesive sheets | Hiroaki Narita, Katsuhisa Taguchi, Yoshitaka Akeda, Takanori Saito | 1993-02-16 |
| 5118567 | Adhesive tape and use thereof | Mikio Komiyama, Yasunao Miyazawa, Takanori Saito | 1992-06-02 |
| 5110388 | Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape | Mikio Komiyama, Yasunao Miyazawa, Takanori Saito | 1992-05-05 |
| 4994300 | Method of making a cover tape for sealing chip-holding parts of carrier tape | Kazumi Itou, Toshio Minagawa | 1991-02-19 |
| 4965127 | Adhesive sheets | Hiroaki Narita, Katsuhisa Taguchi, Yoshitaka Akeda, Takanori Saito | 1990-10-23 |