Kazuyoshi Ebe — 28 Patents at Lintec

Kazuyoshi Ebe has been granted 28 US patents while listed as an inventor at Lintec. The first was granted in 1988 and the most recent in December 2005. Kazuyoshi Ebe ranks #134,628 of 4,157,543 US inventors in our database (top 3.2%). Patent records list Kazuyoshi Ebe in Saitama, JP.

Issued Patents All Time

Showing 1–25 of 28 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
6977024	Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies	Osamu Yamazaki	2005-12-20	$830,000
6911720	Semiconductor device adhesive sheet with conductor bodies buried therein	Osamu Yamazaki	2005-06-28	$618,000
6900550	Semiconductor device including adhesive agent layer with embedded conductor bodies	Osamu Yamazaki	2005-05-31	$677,000
6855418	Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same	Osamu Yamazaki, Hideo Senoo	2005-02-15	$1,061,000
6723619	Pressure sensitive adhesive sheet for semiconductor wafer processing	Koichi Nagamoto	2004-04-20
6718223	Method of processing semiconductor wafer and semiconductor wafer supporting member	Yuichi Iwakata, Hayato Noguchi, Katsuhisa Taguchi	2004-04-06
6702910	Process for producing a chip	Hayato Noguchi	2004-03-09
6465330	Method for grinding a wafer back	Kazuhiro Takahashi, Shinya Takyu	2002-10-15
6436795	Process for producing semiconductor chip	Hayato Noguchi	2002-08-20
6398892	Method of using pressure sensitive adhesive double coated sheet	Hayato Noguchi, Yoshihisa Mineura	2002-06-04
6312800	Pressure sensitive adhesive sheet for producing a chip	Hayato Noguchi	2001-11-06
6297076	Process for preparing a semiconductor wafer	Masazumi Amagai, Hideo Senoo	2001-10-02	$60,963,000
6225194	Process for producing chip and pressure sensitive adhesive sheet for said process	Hayato Noguchi, Yoshihisa Mineura, Hideki Numazawa	2001-05-01
6171672	Cover tape for chip transportation and sealed structure	Hiroshi Koike, Katsuhisa Taguchi	2001-01-09
6156423	Base material and adhesive tape using the same	Kouichi Nagamoto, Takeshi Kondoh, Kazuhiro Takahashi, Katsuhisa Taguchi	2000-12-05
6139953	Adhesive tape, base material for adhesive tape and their manufacturing methods	Kouichi Nagamoto, Mikio Komiyama	2000-10-31
6007920	Wafer dicing/bonding sheet and process for producing semiconductor device	Norito Umehara, Masazumi Amagai, Mamoru Kobayashi	1999-12-28	$30,761,000
5976691	Process for producing chip and pressure sensitive adhesive sheet for said process	Hayato Noguchi, Yoshihisa Mineura, Hideki Numazawa	1999-11-02
5882956	Process for producing semiconductor device	Norito Umehara, Masazumi Amagai, Mamoru Kobayashi	1999-03-16	$61,355,000
5356949	Adhesive composition comprising (meth)acrylate polymer and epoxy resin	Mikio Komiyama, Yasunao Miyazawa, Takanori Saito	1994-10-18
5187007	Adhesive sheets	Hiroaki Narita, Katsuhisa Taguchi, Yoshitaka Akeda, Takanori Saito	1993-02-16
5118567	Adhesive tape and use thereof	Mikio Komiyama, Yasunao Miyazawa, Takanori Saito	1992-06-02
5110388	Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape	Mikio Komiyama, Yasunao Miyazawa, Takanori Saito	1992-05-05
4994300	Method of making a cover tape for sealing chip-holding parts of carrier tape	Kazumi Itou, Toshio Minagawa	1991-02-19
4965127	Adhesive sheets	Hiroaki Narita, Katsuhisa Taguchi, Yoshitaka Akeda, Takanori Saito	1990-10-23

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Kazuyoshi Ebe — 28 Patents

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