Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7589130 | Coating composition, coating film, method of manufacturing coating film, and optical recording medium | Yuki Hongo, Satoru Shoshi, Takeshi Yamasaki, Tomomi Yukumoto | 2009-09-15 |
| 7408259 | Sheet to form a protective film for chips | Takashi Sugino, Osamu Yamazaki | 2008-08-05 |
| 7384676 | Coating composition, hard coat film, and optical disk | Yuki Hongo, Satoru Shoshi, Kazuya Katoh | 2008-06-10 |
| 7361971 | Semiconductor wafer protection structure and laminated protective sheet for use therein | Koichi Nagamoto, Katsuhiko Horigome, Hitoshi Ohashi | 2008-04-22 |
| 7235465 | Process for producing semiconductor chips having a protective film on the back surface | Takashi Sugino, Osamu Yamazaki | 2007-06-26 |
| 7169648 | Process for producing a semiconductor device | Akinori Sato, Osamu Yamazaki, Takashi Sugino | 2007-01-30 |
| 7135224 | Adhesive tape | Takaji Sumi, Osamu Yamazaki, Takashi Sugino | 2006-11-14 |
| 6919262 | Process for producing semiconductor chips | Takashi Sugino, Osamu Yamazaki | 2005-07-19 |
| 6855418 | Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same | Osamu Yamazaki, Kazuyoshi Ebe | 2005-02-15 |
| 6765289 | Reinforcement material for silicon wafer and process for producing IC chip using said material | Yasukazu Nakata, Yuichi Iwakata, Takeshi Kondo | 2004-07-20 |
| 6656819 | Process for producing semiconductor device | Takashi Sugino | 2003-12-02 |
| 6558975 | Process for producing semiconductor device | Takashi Sugino, Kazuhiro Takahashi | 2003-05-06 |
| 6544371 | Method of using a transfer tape | Yoshihisa Mineura | 2003-04-08 |
| 6444310 | Dicing tape and a method of dicing a semiconductor wafer | Takeshi Kondo | 2002-09-03 |
| 6297076 | Process for preparing a semiconductor wafer | Masazumi Amagai, Kazuyoshi Ebe | 2001-10-02 |
| 6277481 | Adhesive composition and adhesive sheet | Takashi Sugino, Yasukazu Nakata | 2001-08-21 |
| 6042922 | Adhesive sheet for wafer setting and process for producing electronic component | Takashi Sugino, Shunsaku Node | 2000-03-28 |
| 5888606 | Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet | Takasi Sugino | 1999-03-30 |
| 5705016 | Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet | Takasi Sugino | 1998-01-06 |