Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408551 | Thermoelectric conversion module | Yuta Seki, Kunihisa Kato, Wataru MORITA, Mutsumi Masumoto | 2025-09-02 |
| 11183416 | Adhesive tape for semiconductor processing, and semiconductor device manufacturing method | Kazuto Aizawa, Jun Maeda | 2021-11-23 |
| 10879104 | Adhesive tape for semiconductor processing and method for producing semiconductor device | Tomochika Tominaga | 2020-12-29 |
| 10825790 | Protective film for semiconductors, semiconductor device, and composite sheet | Naoya Okamoto, Ryohei Ikeda | 2020-11-03 |
| 10460973 | Adhesive tape for semiconductor processing and method for producing semiconductor device | Tomochika Tominaga | 2019-10-29 |
| 10086594 | Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device | Akinori Sato, Yusuke NEZU | 2018-10-02 |
| 7361971 | Semiconductor wafer protection structure and laminated protective sheet for use therein | Hideo Senoo, Koichi Nagamoto, Hitoshi Ohashi | 2008-04-22 |
| 7105226 | Pressure sensitive adhesive double coated sheet and method of use thereof | Hayato Noguchi, Yoshihisa Mineura, Kazuyosi Ebe | 2006-09-12 |