Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7105226 | Pressure sensitive adhesive double coated sheet and method of use thereof | Yoshihisa Mineura, Kazuyosi Ebe, Katsuhiko Horigome | 2006-09-12 |
| 6718223 | Method of processing semiconductor wafer and semiconductor wafer supporting member | Yuichi Iwakata, Katsuhisa Taguchi, Kazuyoshi Ebe | 2004-04-06 |
| 6702910 | Process for producing a chip | Kazuyoshi Ebe | 2004-03-09 |
| 6436795 | Process for producing semiconductor chip | Kazuyoshi Ebe | 2002-08-20 |
| 6398892 | Method of using pressure sensitive adhesive double coated sheet | Yoshihisa Mineura, Kazuyoshi Ebe | 2002-06-04 |
| 6312800 | Pressure sensitive adhesive sheet for producing a chip | Kazuyoshi Ebe | 2001-11-06 |
| 6225194 | Process for producing chip and pressure sensitive adhesive sheet for said process | Yoshihisa Mineura, Hideki Numazawa, Kazuyoshi Ebe | 2001-05-01 |
| 5976691 | Process for producing chip and pressure sensitive adhesive sheet for said process | Yoshihisa Mineura, Hideki Numazawa, Kazuyoshi Ebe | 1999-11-02 |
| 5942578 | Energy beam curable pressure sensitive adhesive composition and use thereof | Takeshi Kondoh | 1999-08-24 |