HN

Hideki Numazawa

LI Lintec: 5 patents #96 of 514Top 20%
NE Nec: 1 patents #7,889 of 14,502Top 55%
Overall (All Time): #1,041,278 of 4,157,543Top 30%
5
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6605345 Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet Michio Kanai 2003-08-12
6524700 Pressure sensitive adhesive sheet for wafer sticking Yasushi Masuda, Osamu Yamazaki 2003-02-25
6225194 Process for producing chip and pressure sensitive adhesive sheet for said process Hayato Noguchi, Yoshihisa Mineura, Kazuyoshi Ebe 2001-05-01
5976691 Process for producing chip and pressure sensitive adhesive sheet for said process Hayato Noguchi, Yoshihisa Mineura, Kazuyoshi Ebe 1999-11-02
5955512 Pressure sensitive adhesive composition and sheet having layer thereof Yoshihisa Mineura 1999-09-21