Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408551 | Thermoelectric conversion module | Yuta Seki, Kunihisa Kato, Wataru MORITA, Katsuhiko Horigome | 2025-09-02 |
| 12154861 | Frame design in embedded die package | Woochan Kim, Masamitsu Matasuura, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +2 more | 2024-11-26 |
| 12125799 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Kengo Aoya, Vivek Kishorechand Arora, Anindya Poddar | 2024-10-22 |
| 12114568 | Method for manufacturing thermoelectric conversion module | Yuta Seki, Kunihisa Kato, Wataru MORITA | 2024-10-08 |
| 11923320 | Semiconductor device having tapered metal coated sidewalls | Tomoko Noguchi, Kengo Aoya, Masamitsu Matsuura | 2024-03-05 |
| 11410875 | Fan-out electronic device | Hau Nguyen, Woochan Kim, Yi Yan, Luu Thanh Nguyen, Ashok S. Prabhu +3 more | 2022-08-09 |
| 11183460 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Kengo Aoya, Vivek Kishorechand Arora, Anindya Poddar | 2021-11-23 |
| 11183441 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2021-11-23 |
| 11158595 | Embedded die package multichip module | Woochan Kim, Masamitsu Matsuura, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2021-10-26 |
| 10580715 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2020-03-03 |
| 8381967 | Bonding a solder bump to a lead using compression and retraction forces | Jesus Bajo Bautista, JR., Raymond Partosa, James Raymond Maliclic Baello | 2013-02-26 |
| 8298947 | Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles | — | 2012-10-30 |
| 8115310 | Copper pillar bonding for fine pitch flip chip devices | Kenji Masumoto | 2012-02-14 |
| 7947602 | Conductive pattern formation method | Chizuko Ito | 2011-05-24 |
| 7851264 | Semiconductor device singulation method | — | 2010-12-14 |
| 7847399 | Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles | — | 2010-12-07 |
| 7754528 | Method for thin semiconductor packages | — | 2010-07-13 |
| 7621969 | Mounting system | Katsumi Terada | 2009-11-24 |
| 7521291 | Method for manufacturing a semiconductor device | — | 2009-04-21 |
| 7459339 | Flip-chip semiconductor device manufacturing method | — | 2008-12-02 |
| 7157363 | Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion | Takanao Suzuki, Masatoshi Inaba, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka +2 more | 2007-01-02 |
| 7023088 | Semiconductor package, semiconductor device and electronic device | Takanao Suzuki, Masatoshi Inaba, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka +2 more | 2006-04-04 |
| 6969919 | Semiconductor package production method and semiconductor package | Kiyoshi Yajima, Chihiro Hatano, Kimitaka Nishio, Noriyuki Kirikae | 2005-11-29 |
| 6929971 | Semiconductor device and its manufacturing method | Kensho Murata, Kenji Masumoto | 2005-08-16 |
| 6887778 | Semiconductor device and manufacturing method | Masako Watanabe | 2005-05-03 |