Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412795 | Dual down-set conductive terminals for externally mounted passive components | — | 2025-09-09 |
| 12334417 | Leaded semiconductor device package having leads with different widths | — | 2025-06-17 |
| 12272626 | Conductive members atop semiconductor packages | Makoto Shibuya, Kengo Aoya, Anindya Poddar | 2025-04-08 |
| 12259445 | Hall sensor using face down structure with through substrate vias | Daiki Komatsu | 2025-03-25 |
| 12160219 | Metal ribs in electromechanical devices | Anindya Poddar, Hau Nguyen | 2024-12-03 |
| 12074134 | Package for stress sensitive component and semiconductor device | Anindya Poddar, Mahmud Halim Chowdhury, Hau Nguyen, Ting-Ta Yen | 2024-08-27 |
| 12057417 | Wafer chip scale package | Daiki Komatsu | 2024-08-06 |
| 11942384 | Semiconductor package having an interdigitated mold arrangement | Makoto Shibuya, Kengo Aoya, Hideaki Matsunaga, Anindya Poddar | 2024-03-26 |
| 11923320 | Semiconductor device having tapered metal coated sidewalls | Tomoko Noguchi, Mutsumi Masumoto, Kengo Aoya | 2024-03-05 |
| 11848244 | Leaded wafer chip scale packages | Makoto Shibuya, Kengo Aoya | 2023-12-19 |
| 11736085 | Metal ribs in electromechanical devices | Anindya Poddar, Hau Nguyen | 2023-08-22 |
| 11410875 | Fan-out electronic device | Hau Nguyen, Woochan Kim, Yi Yan, Luu Thanh Nguyen, Ashok S. Prabhu +3 more | 2022-08-09 |
| 11183441 | Stress buffer layer in embedded package | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2021-11-23 |
| 11158595 | Embedded die package multichip module | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2021-10-26 |
| 10879144 | Semiconductor package with multilayer mold | Kengo Aoya, Takeshi Onogami, Hideaki Matsunaga | 2020-12-29 |
| 10580715 | Stress buffer layer in embedded package | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2020-03-03 |
| 5785140 | Vehicular vibration isolating apparatus | Takehiro Suzuki | 1998-07-28 |