Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879144 | Semiconductor package with multilayer mold | Kengo Aoya, Masamitsu Matsuura, Hideaki Matsunaga | 2020-12-29 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879144 | Semiconductor package with multilayer mold | Kengo Aoya, Masamitsu Matsuura, Hideaki Matsunaga | 2020-12-29 |