Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11979986 | Component-embedded substrate | Masakazu Sato, Nobuki Ueta, Yoshio Nakao | 2024-05-07 |
| 11638351 | Component-embedded substrate | Masakazu Sato, Nobuki Ueta, Yoshio Nakao | 2023-04-25 |
| 9006579 | Method of manufacturing printed circuit board and printed circuit board | Hiroshi Miyata, Hirohito Watanabe | 2015-04-14 |
| 8282841 | Printed circuit board and manufacturing method thereof | Kanako Nakajima, Yoshiharu Unami | 2012-10-09 |
| 7476812 | Printed circuit board and manufacturing method thereof | Kanako Nakajima, Yoshiharu Unami | 2009-01-13 |
| 7157363 | Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion | Takanao Suzuki, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka, Nobuyuki Sadakata +2 more | 2007-01-02 |
| 7023088 | Semiconductor package, semiconductor device and electronic device | Takanao Suzuki, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka, Nobuyuki Sadakata +2 more | 2006-04-04 |
| 6835595 | Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package | Takanao Suzuki, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka, Nobuyuki Sadakata +2 more | 2004-12-28 |
| 6387734 | Semiconductor package, semiconductor device, electronic device and production method for semiconductor package | Takanao Suzuki, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka | 2002-05-14 |