Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8298874 | Packaged electronic devices having die attach regions with selective thin dielectric layer | Bernardo Gallegos | 2012-10-30 |
| 8222748 | Packaged electronic devices having die attach regions with selective thin dielectric layer | Bernardo Gallegos | 2012-07-17 |
| 8115310 | Copper pillar bonding for fine pitch flip chip devices | Mutsumi Masumoto | 2012-02-14 |
| 7679002 | Semiconductive device having improved copper density for package-on-package applications | Masazumi Amagai | 2010-03-16 |
| 7344916 | Package for a semiconductor device | — | 2008-03-18 |
| 7157363 | Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion | Takanao Suzuki, Masatoshi Inaba, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka +2 more | 2007-01-02 |
| 7023088 | Semiconductor package, semiconductor device and electronic device | Takanao Suzuki, Masatoshi Inaba, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka +2 more | 2006-04-04 |
| 7005719 | Integrated circuit structure having a flip-chip mounted photoreceiver | — | 2006-02-28 |
| 6992380 | Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area | — | 2006-01-31 |
| 6929971 | Semiconductor device and its manufacturing method | Kensho Murata, Mutsumi Masumoto | 2005-08-16 |
| 6894374 | Semiconductor package insulation film and manufacturing method thereof | Makoto Yoshino | 2005-05-17 |
| 6876077 | Semiconductor device and its manufacturing method | Kensho Murata, Mutsumi Masumoto | 2005-04-05 |
| 6875637 | Semiconductor package insulation film and manufacturing method thereof | Makoto Yoshino | 2005-04-05 |
| 6835595 | Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package | Takanao Suzuki, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka, Masatoshi Inaba +2 more | 2004-12-28 |
| 6830956 | Method for packaging a low profile semiconductor device | Mutsumi Masumoto | 2004-12-14 |
| 6780749 | Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges | Mutsumi Masumoto, Akira Karashima | 2004-08-24 |
| 6759745 | Semiconductor device and manufacturing method thereof | Mutsumi Masumoto | 2004-07-06 |
| 6734532 | Back side coating of semiconductor wafers | Sreenivasan K. Koduri, Mutsumi Masumoto | 2004-05-11 |
| 6583483 | Semiconductor device and its manufacturing method | Mutsumi Masumoto, Akira Karashima | 2003-06-24 |
| 6525424 | Semiconductor device and its manufacturing method | Kensho Murata, Mutsumi Masumoto | 2003-02-25 |
| 6482730 | Method for manufacturing a semiconductor device | Mutsumi Masumoto | 2002-11-19 |
| 6269999 | Semiconductor chip mounting method utilizing ultrasonic vibrations | Tomohiro Okazaki, Mutsumi Masumoto, Katsumi Yamaguchi | 2001-08-07 |
| 5258331 | Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars | Takashi Nakashima | 1993-11-02 |
| 5176366 | Resin-encapsulated semiconductor device package with nonconductive tape embedded between outer lead portions | Takashi Nakashima | 1993-01-05 |