Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11230649 | Electrically conductive adhesive film and dicing-die bonding film using the same | Naoaki Mihara, Jirou Sugiyama | 2022-01-25 |
| 11193047 | Electrically conductive adhesive film and dicing-die bonding film using the same | Naoaki Mihara, Jirou Sugiyama | 2021-12-07 |
| 11136479 | Electrically conductive adhesive film and dicing-die bonding film using the same | Naoaki Mihara, Jirou Sugiyama | 2021-10-05 |
| 11139261 | Film-like adhesive and method for producing semiconductor package using film-like adhesive | Minoru Morita | 2021-10-05 |
| 11066577 | Electrically conductive adhesive film and dicing-die bonding film using the same | Naoaki Mihara, Jirou Sugiyama | 2021-07-20 |
| 10689550 | Electrically conductive composition | Naoaki Mihara, Jirou Sugiyama | 2020-06-23 |
| 10563096 | Conductive adhesive composition | Masami Aoyama | 2020-02-18 |
| 10115707 | Adhesive film and semiconductor package using adhesive film | Masami Aoyama | 2018-10-30 |
| 9101062 | Highly heat conductive polyimide film, highly heat conductive metal-clad laminate, and method for producing the same | Eijiro Aoyagi, Hongyuan Wang, Katsufumi Hiraishi | 2015-08-04 |
| 6969919 | Semiconductor package production method and semiconductor package | Kiyoshi Yajima, Mutsumi Masumoto, Chihiro Hatano, Kimitaka Nishio | 2005-11-29 |
| 6774496 | Semiconductor package with a thermoset bond | Kiyoshi Yajima, Mutsumi Masumoto, Chihiro Hatano, Kimitaka Nishio | 2004-08-10 |
| 6716674 | Method of forming a semiconductor package | Kiyoshi Yajima, Mutsumi Masumoto, Chihiro Hatano, Kimitaka Nishio | 2004-04-06 |