Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10699933 | Wafer-fixing tape, method of processing a semiconductor wafer, and semiconductor chip | Yoshifumi OKA | 2020-06-30 |
| 10563096 | Conductive adhesive composition | Noriyuki Kirikae | 2020-02-18 |
| 10418267 | Method of processing a semiconductor wafer, semiconductor chip, and surface protective tape | Yoshifumi OKA | 2019-09-17 |
| 10196534 | Resin composition for sealing electronic device, and electronic device | Takumi Asanuma, Yasushi Ishizaka, Tetsuya Mieda | 2019-02-05 |
| 10196547 | Resin composition for sealing electronic device, and electronic device | Takumi Asanuma, Yasushi Ishizaka | 2019-02-05 |
| 10115707 | Adhesive film and semiconductor package using adhesive film | Noriyuki Kirikae | 2018-10-30 |
| 10043996 | Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device | Tetsuya Mieda, Keiji Saito, Kunihiko ISHIGURO, Toshimitsu Nakamura, Naoaki Mihara +1 more | 2018-08-07 |
| 9758690 | Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying image | Kunihiko ISHIGURO, Tetsuya Mieda, Keiji Saito, Toshimitsu Nakamura, Naoaki Mihara +1 more | 2017-09-12 |
| 9631123 | Adhesive sheet | Hiromitsu Maruyama | 2017-04-25 |
| 9523023 | Adhesive sheet | Hiromitsu Maruyama | 2016-12-20 |