Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10988646 | Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same | Tetsuya Mieda, Takumi Asanuma | 2021-04-27 |
| 10829669 | Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device | Tetsuya Mieda, Takumi Asanuma | 2020-11-10 |
| 10556974 | Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic device | Tetsuya Mieda, Takumi Asanuma | 2020-02-11 |
| 10196547 | Resin composition for sealing electronic device, and electronic device | Masami Aoyama, Takumi Asanuma | 2019-02-05 |
| 10196534 | Resin composition for sealing electronic device, and electronic device | Takumi Asanuma, Masami Aoyama, Tetsuya Mieda | 2019-02-05 |
| 10084153 | Filler material for organic electroluminescent element and method of sealing organic electroluminiscent element | Naoaki Mihara, Tetsuya Mieda | 2018-09-25 |
| 10079360 | Resin composition for sealing electronic devices, and electronic device | Tetsuya Mieda, Takumi Asanuma, Keiji Saito | 2018-09-18 |
| 9793511 | Filler material for organic electroluminescent element and method of sealing organic electroluminescent element | Naoaki Mihara, Tetsuya Mieda, Kunihiko ISHIGURO | 2017-10-17 |