Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9219052 | Making a flip-chip assembly with bond fingers | Jesus Bajo Bautista, JR., James Raymond Maliclic Baello, Roxanna Bauzon Samson | 2015-12-22 |
| 8766461 | Substrate with bond fingers | Jesus Bajo Bautista, JR., James Raymond Maliclic Baello, Roxanna Bauzon Samson | 2014-07-01 |
| 8381967 | Bonding a solder bump to a lead using compression and retraction forces | Mutsumi Masumoto, Jesus Bajo Bautista, JR., James Raymond Maliclic Baello | 2013-02-26 |
| 7326025 | System for detecting warped carriers and associated methods | Ramil A. Viluan, Romulo D. Casallo, Jr., Melvin B. Alviar | 2008-02-05 |
| 7000822 | Wire bond integrity test system | Allan I. Dacanay, Enrique Ferrer | 2006-02-21 |
| 6808943 | Method of fabricating wire bond integrity test system | Allan I. Dacanay, Enrique Ferrer | 2004-10-26 |
| 6650011 | Porous ceramic work stations for wire and die bonders | Allan C. Soriano, Enrique Ferrer, Ramil A. Viluan, Melvin B. Alviar, Jose Franco A. Alicante | 2003-11-18 |