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Home › Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same

Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same

US Patent 6855418 · Granted Feb 15, 2005

Estimated economic value: $1,061,000 ⓘ

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