Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Adhesive tape, base material for adhesive tape and their manufacturing methods

Adhesive tape, base material for adhesive tape and their manufacturing methods

US Patent 6139953 · Granted Oct 31, 2000

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Die-sorting sheet and method for transporting chips having adhesive layer2013
Method for manufacturing semiconductor device using adhesive sheet with embedded2005
Semiconductor device adhesive sheet with conductor bodies buried therein2005
Semiconductor device including adhesive agent layer with embedded conductor bodi2005
Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin ti2005
Pressure sensitive adhesive sheet for semiconductor wafer processing2004
Method of processing semiconductor wafer and semiconductor wafer supporting memb2004
Process for producing a chip2004
Method for grinding a wafer back2002
Process for producing semiconductor chip2002
Method of using pressure sensitive adhesive double coated sheet2002
Pressure sensitive adhesive sheet for producing a chip2001