Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784022 | Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuits | Masazumi Amagai | 2004-08-31 |
| 6713851 | Lead over chip semiconductor device including a heat sink for heat dissipation | Masazumi Amagai | 2004-03-30 |
| 6713881 | Semiconductor device and method of manufacturing same | Yoshikatsu Umeda | 2004-03-30 |
| 6380634 | Conductor wires and semiconductor device using them | — | 2002-04-30 |
| 6268644 | Semiconductor device | Takahiro Imura, Yoshikatsu Umeda | 2001-07-31 |
| 6225703 | Semiconductor device | Chikara Azuma, Akira Karashima | 2001-05-01 |
| 6118183 | Semiconductor device, manufacturing method thereof, and insulating substrate for same | Masazumi Amagai | 2000-09-12 |
| 6007920 | Wafer dicing/bonding sheet and process for producing semiconductor device | Masazumi Amagai, Mamoru Kobayashi, Kazuyoshi Ebe | 1999-12-28 |
| 5960260 | Semiconductor device, its manufacturing method, and dicing adhesive element therefor | Masazumi Amagai | 1999-09-28 |
| 5920116 | Rigidized lead frame for a semiconductor device | Akira Karashima | 1999-07-06 |
| 5882956 | Process for producing semiconductor device | Masazumi Amagai, Mamoru Kobayashi, Kazuyoshi Ebe | 1999-03-16 |
| 5623123 | Semiconductor device package with small die pad and method of making same | — | 1997-04-22 |