Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8294261 | Protruding TSV tips for enhanced heat dissipation for IC devices | Kazuaki MAWATARI, Kengo Aoya, Jeffrey Alan West | 2012-10-23 |
| 7926698 | Spot heat wirebonding | Norihiro Kawakami, Sohichi Kadoguchi | 2011-04-19 |
| 7677432 | Spot heat wirebonding | Norihiro Kawakami, Sohichi Kadoguchi | 2010-03-16 |
| 6713881 | Semiconductor device and method of manufacturing same | Norito Umehara | 2004-03-30 |
| 6268644 | Semiconductor device | Norito Umehara, Takahiro Imura | 2001-07-31 |