Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12163894 | Sensing system and storage medium storing data structure used in sensing system | Hodaka MORI, Kazuki KODA | 2024-12-10 |
| 12125813 | Semiconductor device and method for manufacturing same | Shinji Kawano | 2024-10-22 |
| 11699672 | Semiconductor device and method for manufacturing same | Mariko Fujieda, Shinji Kawano | 2023-07-11 |
| 11565659 | Raindrop recognition device, vehicular control apparatus, method of training model, and trained model | Yoshihisa Banno, Sho Takano, Masaaki Inoguchi, Keigo Hikida | 2023-01-31 |
| 11355357 | Semiconductor device and method for producing the semiconductor device | — | 2022-06-07 |
| 11183480 | Semiconductor device | — | 2021-11-23 |
| 11127702 | Semiconductor device and method for manufacturing same | Mariko Fujieda, Ryuta Ikoma, Kazuya Hirasawa, Shinji Kawano | 2021-09-21 |
| 11027360 | Bonded body and method for manufacturing the same | — | 2021-06-08 |
| 10983022 | Pressure sensor | Shinji Kawano | 2021-04-20 |
| 9119336 | Bonding structure manufacturing method, heating and melting treatment method, and system therefor | Hideyuki Abe | 2015-08-25 |
| 8757474 | Bonding structure manufacturing method, heating and melting treatment method, and system therefor | Hideyuki Abe | 2014-06-24 |
| 8587122 | Semiconductor flip-chip system having three-dimensional solder joints | — | 2013-11-19 |
| 8294261 | Protruding TSV tips for enhanced heat dissipation for IC devices | Kengo Aoya, Yoshikatsu Umeda, Jeffrey Alan West | 2012-10-23 |