Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125817 | Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other | Martin Becker, André Bastos Abibe, Ronald Eisele, Frank Osterwald, David Benning | 2024-10-22 |
| 11400514 | Sintering tool and method for sintering an electronic subassembly | Frank Osterwald, Martin Becker, Lars Paulsen, Holger Ulrich, Ronald Eisele | 2022-08-02 |
| 10814396 | Sintering tool and method for sintering an electronic subassembly | Frank Osterwald, Martin Becker, Lars Paulsen, Holger Ulrich, Ronald Eisele | 2020-10-27 |
| 10818633 | Sintering tool for the lower die of a sintering device | Frank Osterwald, Ronald Eisele, Martin Becker, Lars Paulsen, Holger Ulrich | 2020-10-27 |
| 10622331 | Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component | Andreas Hinrich, Susanne Klaudia DUCH, Anton-Zoran MIRIC, Michael Schäfer, Christian Bachmann +6 more | 2020-04-14 |
| 10607962 | Method for manufacturing semiconductor chips | Frank Osterwald, Martin Becker, Holger Ulrich, Ronald Eisele | 2020-03-31 |
| 10483229 | Sintering device | Frank Osterwald, Ronald Eisele, Martin Becker, Lars Paulsen, Holger Ulrich | 2019-11-19 |
| 10438924 | Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module | Martin Becker, Ronald Eisele, Frank Osterwald, Holger Ulrich | 2019-10-08 |
| 10332858 | Electronic sandwich structure with two parts joined together by means of a sintering layer | Martin Becker, Ronald Eisele, Frank Osterwald | 2019-06-25 |
| 10079219 | Power semiconductor contact structure and method for the production thereof | Martin Becker, Ronald Eisele, Frank Osterwald | 2018-09-18 |
| 9786627 | Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips | Martin Becker, Ronald Eisele, Frank Osterwald | 2017-10-10 |
| 9613929 | Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof | Martin Becker, Ronald Eisele, Frank Osterwald | 2017-04-04 |
| 9318421 | Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof | Martin Becker, Ronald Eisele, Frank Osterwald | 2016-04-19 |