Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12139005 | Component node and a component carrier for the component node | — | 2024-11-12 |
| 11801772 | Thermal management module and operating method | Kristian Haase | 2023-10-31 |
| 11776932 | Process and device for low-temperature pressure sintering | Ronald Eisele | 2023-10-03 |
| 11708010 | Operating method for a thermo-management module | Kristian Haase | 2023-07-25 |
| 11626383 | Process and device for low-temperature pressure sintering | Ronald Eisele | 2023-04-11 |
| 11400514 | Sintering tool and method for sintering an electronic subassembly | Frank Osterwald, Martin Becker, Lars Paulsen, Jacek Rudzki, Ronald Eisele | 2022-08-02 |
| 11292448 | Longitudinal driver assistance system in a motor vehicle | Stefan Knoller, Walter Kagerer, Andreas Lechner | 2022-04-05 |
| 10814396 | Sintering tool and method for sintering an electronic subassembly | Frank Osterwald, Martin Becker, Lars Paulsen, Jacek Rudzki, Ronald Eisele | 2020-10-27 |
| 10818633 | Sintering tool for the lower die of a sintering device | Frank Osterwald, Ronald Eisele, Martin Becker, Jacek Rudzki, Lars Paulsen | 2020-10-27 |
| 10622331 | Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component | Andreas Hinrich, Susanne Klaudia DUCH, Anton-Zoran MIRIC, Michael Schäfer, Christian Bachmann +6 more | 2020-04-14 |
| 10607962 | Method for manufacturing semiconductor chips | Frank Osterwald, Martin Becker, Ronald Eisele, Jacek Rudzki | 2020-03-31 |
| 10483229 | Sintering device | Frank Osterwald, Ronald Eisele, Martin Becker, Lars Paulsen, Jacek Rudzki | 2019-11-19 |
| 10438924 | Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module | Martin Becker, Ronald Eisele, Frank Osterwald, Jacek Rudzki | 2019-10-08 |
| 10381283 | Power semiconductor module | Frank Osterwald, Ronald Eisele | 2019-08-13 |