Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125817 | Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other | Martin Becker, André Bastos Abibe, Ronald Eisele, Jacek Rudzki, David Benning | 2024-10-22 |
| 11400514 | Sintering tool and method for sintering an electronic subassembly | Martin Becker, Lars Paulsen, Jacek Rudzki, Holger Ulrich, Ronald Eisele | 2022-08-02 |
| 10832995 | Power module | Ronald Eisele | 2020-11-10 |
| 10818633 | Sintering tool for the lower die of a sintering device | Ronald Eisele, Martin Becker, Jacek Rudzki, Lars Paulsen, Holger Ulrich | 2020-10-27 |
| 10814396 | Sintering tool and method for sintering an electronic subassembly | Martin Becker, Lars Paulsen, Jacek Rudzki, Holger Ulrich, Ronald Eisele | 2020-10-27 |
| 10622331 | Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component | Andreas Hinrich, Susanne Klaudia DUCH, Anton-Zoran MIRIC, Michael Schäfer, Christian Bachmann +6 more | 2020-04-14 |
| 10607962 | Method for manufacturing semiconductor chips | Martin Becker, Holger Ulrich, Ronald Eisele, Jacek Rudzki | 2020-03-31 |
| 10483229 | Sintering device | Ronald Eisele, Martin Becker, Lars Paulsen, Jacek Rudzki, Holger Ulrich | 2019-11-19 |
| 10438924 | Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module | Martin Becker, Ronald Eisele, Jacek Rudzki, Holger Ulrich | 2019-10-08 |
| 10403566 | Power module | Ronald Eisele | 2019-09-03 |
| 10381283 | Power semiconductor module | Ronald Eisele, Holger Ulrich | 2019-08-13 |
| 10332858 | Electronic sandwich structure with two parts joined together by means of a sintering layer | Martin Becker, Ronald Eisele, Jacek Rudzki | 2019-06-25 |
| 10306800 | Cooling trough, cooler and power module assembly | Franke Wulf-Toke, Ronald Eisele, Reiner Hinken, Klaus Olesen, Lars Paulsen | 2019-05-28 |
| 10079219 | Power semiconductor contact structure and method for the production thereof | Martin Becker, Ronald Eisele, Jacek Rudzki | 2018-09-18 |
| 9786627 | Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips | Martin Becker, Ronald Eisele, Jacek Rudzki | 2017-10-10 |
| 9613929 | Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof | Martin Becker, Ronald Eisele, Jacek Rudzki | 2017-04-04 |
| 9318421 | Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof | Martin Becker, Ronald Eisele, Jacek Rudzki | 2016-04-19 |