Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7071576 | Semiconductor device and method of manufacturing the same | Chiaki Takubo | 2006-07-04 |
| 6337258 | Method of dividing a wafer | Shinya Takyu, Keisuke Tokubuchi, Tetsuya Kurosawa | 2002-01-08 |
| 6294439 | Method of dividing a wafer and method of manufacturing a semiconductor device | Shigeo Sasaki, Shinya Takyu, Keisuke Tokubuchi, Koichi Yazima | 2001-09-25 |
| 6184109 | Method of dividing a wafer and method of manufacturing a semiconductor device | Shigeo Sasaki, Shinya Takyu, Keisuke Tokubuchi, Koichi Yazima | 2001-02-06 |
| 5107325 | Structure and method of packaging a semiconductor device | — | 1992-04-21 |