Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8241999 | Semiconductor device having a protection pattern with two element separation regions | Takafumi Ikeda, Hideaki Maekawa, Yuuichi Tatsumi, Toshifumi Minami | 2012-08-14 |
| 6774011 | Chip pickup device and method of manufacturing semiconductor device | Tetsuya Kurosawa, Hideo Numata, Shinya Takyu | 2004-08-10 |
| 6448665 | Semiconductor package and manufacturing method thereof | Yoshiaki Sugizaki | 2002-09-10 |
| 6379484 | Method for manufacturing a semiconductor package | Hiroshi Nomura, Yumiko Ohshima | 2002-04-30 |
| 6191024 | Apparatus and method for manufacturing a semiconductor package | Hiroshi Nomura, Yumiko Ohshima | 2001-02-20 |
| 6011312 | Flip-chip semiconductor package | Yumiko Ohshima | 2000-01-04 |
| 5998243 | Method for manufacturing semiconductor device and apparatus for resin-encapsulating | Teikou Odashima, Mikio Matsui, Yoshiaki Sugizaki | 1999-12-07 |
| 5935375 | Apparatus and method for manufacturing a semiconductor package | Hiroshi Nomura, Yumiko Ohshima | 1999-08-10 |
| 5677246 | Method of manufacturing semiconductor devices | Hideaki Maeta, Katsuhiko Oyama, Hiroshi Iwasaki, Yumiko Ohshima | 1997-10-14 |