Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436331 | Method of resin sealing a gap between a semiconductor chip and a substrate | Takaki Kuno, Hirotaka Okamoto, Shoji Yamamoto | 2002-08-20 |
| 5998243 | Method for manufacturing semiconductor device and apparatus for resin-encapsulating | Mikio Matsui, Yoshiaki Sugizaki, Takahito Nakazawa | 1999-12-07 |