Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7901797 | Low-adhesion material, resin molding die, and soil resistant material | Yoshinori Noguchi, Keiji Maeda, Satoshi Kitaoka, Naoki Kawashima | 2011-03-08 |
| 7784764 | Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material | Yoshinori Noguchi, Keiji Maeda, Seiichi Suda, Satoshi Kitaoka, Naoki Kawashima +1 more | 2010-08-31 |
| 7732037 | Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material | Keiji Maeda, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima | 2010-06-08 |
| 7614293 | Method of evaluating adhesion property, low-adhesion material, and mold for molding resin | Keiji Maeda, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima, Seiichi Suda +2 more | 2009-11-10 |
| 7407146 | Composite material and resin mold | Keiji Maeda, Yosinori Noguchi, Satoshi Kitaoka, Naoki Kawashima | 2008-08-05 |
| 7287975 | Resin mold material and resin mold | Kazuhiko Bandoh, Keiji Maeda, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima | 2007-10-30 |
| 6436331 | Method of resin sealing a gap between a semiconductor chip and a substrate | Hirotaka Okamoto, Shoji Yamamoto, Teikou Odashima | 2002-08-20 |
| 5753538 | Method of sealing electronic parts with molded resin and mold employed therefor | Yoshihisa Kawamoto, Makoto Matsuo, Koichi Araki, Satoshi Nihei | 1998-05-19 |