Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5834035 | Method of and apparatus for molding resin to seal electronic parts | Michio Osada, Yoshihisa Kawamoto, Makoto Matsuo | 1998-11-10 |
| 5753538 | Method of sealing electronic parts with molded resin and mold employed therefor | Takaki Kuno, Yoshihisa Kawamoto, Makoto Matsuo, Satoshi Nihei | 1998-05-19 |
| 5603879 | Method of molding resin to seal electronic parts using two evacuation steps | Michio Osada, Yoshihisa Kawamoto, Makoto Matsuo | 1997-02-18 |