Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6773247 | Die used for resin-sealing and molding an electronic component | Michio Osada, Keiji Maeda, Yoshiji Shimizu, Toshiyuki Nishimura, Susumu Yamahara | 2004-08-10 |
| 5834035 | Method of and apparatus for molding resin to seal electronic parts | Michio Osada, Makoto Matsuo, Koichi Araki | 1998-11-10 |
| 5753538 | Method of sealing electronic parts with molded resin and mold employed therefor | Takaki Kuno, Makoto Matsuo, Koichi Araki, Satoshi Nihei | 1998-05-19 |
| 5750154 | Resin sealing/molding apparatus for electronic parts | Keiji Maeda | 1998-05-12 |
| 5603879 | Method of molding resin to seal electronic parts using two evacuation steps | Michio Osada, Makoto Matsuo, Koichi Araki | 1997-02-18 |
| 5507633 | Resin molding apparatus for sealing an electronic device | Michio Osada | 1996-04-16 |
| 5435953 | Method of molding resin for sealing an electronic device | Michio Osada | 1995-07-25 |