Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5753538 | Method of sealing electronic parts with molded resin and mold employed therefor | Takaki Kuno, Yoshihisa Kawamoto, Makoto Matsuo, Koichi Araki | 1998-05-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5753538 | Method of sealing electronic parts with molded resin and mold employed therefor | Takaki Kuno, Yoshihisa Kawamoto, Makoto Matsuo, Koichi Araki | 1998-05-19 |