Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6773247 | Die used for resin-sealing and molding an electronic component | Michio Osada, Keiji Maeda, Yoshihisa Kawamoto, Toshiyuki Nishimura, Susumu Yamahara | 2004-08-10 |
| 6232364 | Ultraviolet curable coating compositions for cationic electrodeposition applicable to metallic materials and electrically conductive plastic materials | Masao Fukuda | 2001-05-15 |
| 5160422 | Bath for immersion plating tin-lead alloys | Shigefumi Nishimura, Masao Fukuda | 1992-11-03 |