Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8611372 | Data transfer system and method | — | 2013-12-17 |
| 7957416 | Data transfer system and method | — | 2011-06-07 |
| 7901797 | Low-adhesion material, resin molding die, and soil resistant material | Takaki Kuno, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima | 2011-03-08 |
| 7784764 | Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material | Takaki Kuno, Yoshinori Noguchi, Seiichi Suda, Satoshi Kitaoka, Naoki Kawashima +1 more | 2010-08-31 |
| 7760662 | Data transfer system and method | — | 2010-07-20 |
| 7732037 | Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material | Takaki Kuno, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima | 2010-06-08 |
| 7614293 | Method of evaluating adhesion property, low-adhesion material, and mold for molding resin | Takaki Kuno, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima, Seiichi Suda +2 more | 2009-11-10 |
| 7486690 | Data transfer system and method of transferring data packets using aggregation/disaggregation | — | 2009-02-03 |
| 7407146 | Composite material and resin mold | Takaki Kuno, Yosinori Noguchi, Satoshi Kitaoka, Naoki Kawashima | 2008-08-05 |
| 7399574 | Curable resin for photo-patterning, process for producing the same, curable resin composition, color filter, liquid crystal panel substrate, and liquid crystal panel | Shinji Hayashi, Shunsuke Sega, Hiromu Taguchi, Mitsutaka Hasegawa, Eiichi Okazaki | 2008-07-15 |
| 7287975 | Resin mold material and resin mold | Kazuhiko Bandoh, Takaki Kuno, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima | 2007-10-30 |
| 7084186 | Crosslinkable resin compositions | Eiichi Okazaki, Hideo Matsuzaki, Kuniniko Mizotani | 2006-08-01 |
| 6904049 | Data transfer system and method for transferring data packets over an ATM link | — | 2005-06-07 |
| 6773247 | Die used for resin-sealing and molding an electronic component | Michio Osada, Yoshihisa Kawamoto, Yoshiji Shimizu, Toshiyuki Nishimura, Susumu Yamahara | 2004-08-10 |
| 6368707 | Heat-sensitive adhesive sheet | Daisuke Kamiya, Hiroyuki Ota | 2002-04-09 |
| 6346433 | Method of coating semiconductor wafer with resin and mold used therefor | Shigeru Miyagawa | 2002-02-12 |
| 5783220 | Resin sealing and molding apparatus for sealing electronic parts | Michio Osada | 1998-07-21 |
| 5750154 | Resin sealing/molding apparatus for electronic parts | Yoshihisa Kawamoto | 1998-05-12 |