Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7287975 | Resin mold material and resin mold | Keiji Maeda, Takaki Kuno, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima | 2007-10-30 |
| 6594889 | Method for processing leadframe | Michio Osada, Tsuyoshi Amakawa, Yoshihiko Kojima, Fumio Takashima, Kouichi Kawamura | 2003-07-22 |
| 6007316 | Apparatus for molding resin to seal electronic parts | — | 1999-12-28 |
| 5750059 | Method of molding resin to seal electronic parts | — | 1998-05-12 |