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Image forming system and image forming method |
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2012-03-20 |
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Image forming apparatus, image forming system and computer program of the same for forming cover sheet |
Junichi Isamikawa |
2010-06-15 |
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Method of manufacturing semiconductor resin molding and resin member employed therefor |
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2005-07-19 |
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Die used for resin-sealing and molding an electronic component |
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2004-08-10 |
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Cutting apparatus and cutting method |
Masataka Takehara, Makoto Matsuo |
2004-05-18 |
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Polishing apparatus and polishing method |
Makoto Matsuo, Masataka Takehara |
2004-03-30 |
| 6594889 |
Method for processing leadframe |
Kazuhiko Bandoh, Tsuyoshi Amakawa, Yoshihiko Kojima, Fumio Takashima, Kouichi Kawamura |
2003-07-22 |
| 6438826 |
Electronic component, method of sealing electronic component with resin, and apparatus therefor |
Shinji Takase, Hirotaka Okamoto, Kouichi Araki |
2002-08-27 |
| 6258628 |
Method and apparatus for processing resin sealed lead frame |
Tetsuo Hidaka, Kazuo Horiuchi |
2001-07-10 |
| 5874324 |
Method of sealing electronic component with molded resin |
— |
1999-02-23 |
| 5834035 |
Method of and apparatus for molding resin to seal electronic parts |
Yoshihisa Kawamoto, Makoto Matsuo, Koichi Araki |
1998-11-10 |
| 5783220 |
Resin sealing and molding apparatus for sealing electronic parts |
Keiji Maeda |
1998-07-21 |
| 5768655 |
Image forming apparatus and control method thereof |
Kunihisa Yoshino, Yoshiko Matsuoka, Jun Yokobori, Akitoshi Matsubara |
1998-06-16 |
| 5603879 |
Method of molding resin to seal electronic parts using two evacuation steps |
Yoshihisa Kawamoto, Makoto Matsuo, Koichi Araki |
1997-02-18 |
| 5507633 |
Resin molding apparatus for sealing an electronic device |
Yoshihisa Kawamoto |
1996-04-16 |
| 5435953 |
Method of molding resin for sealing an electronic device |
Yoshihisa Kawamoto |
1995-07-25 |
| 5200125 |
Method for seal molding electronic components with resin |
— |
1993-04-06 |
| 5159666 |
Apparatus and a method for enlarging dot matrix data |
Kunio Fukuda, Masaki Kobayashi |
1992-10-27 |
| 5153708 |
Tape carrier used in tab system |
Naoharu Ohikata, Tadashi Kamiyama |
1992-10-06 |
| 5031022 |
Film carrier for mounting IC chips |
Toshio Yamamoto, Tamio Saito, Naoharu Ohikata, Jiro Ohno |
1991-07-09 |
| 4862586 |
Lead frame for enclosing semiconductor chips with resin |
— |
1989-09-05 |
| 4793785 |
Apparatus of multiplunger type for enclosing semiconductor elements with resin |
— |
1988-12-27 |
| 4723899 |
Molding apparatus for enclosing semiconductor chips with resin |
— |
1988-02-09 |
| 4543684 |
Apparatus for cleaning plastics forming mold faces |
Kazuo Bandoh |
1985-10-01 |
