Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7207868 | Cutting apparatus | Masaharu Yoshida, Yasuyuki Kitagawa, Kazuyuki Kishimoto, Kiyoharu Kato | 2007-04-24 |
| 6851355 | Pressing method, pressing mechanism and resin molding device | Akiyuki Harada | 2005-02-08 |
| 6736703 | Cutting apparatus and cutting method | Michio Osada, Makoto Matsuo | 2004-05-18 |
| 6712674 | Polishing apparatus and polishing method | Makoto Matsuo, Michio Osada | 2004-03-30 |
| 6476507 | Resin sealing method and resin sealing apparatus | — | 2002-11-05 |
| 6402497 | Mold clamping device with improved clamping force transmission mechanism | Toshinobu Banjyo, Shinichi Hasegawa, Haruo Yoshida | 2002-06-11 |
| 6358776 | Method of fabricating an electronic component and apparatus used therefor | Osamu Nakagawa | 2002-03-19 |
| 5606182 | Optical semiconductor device for optical communications with increased positional accuracy of an optical access and method of fabricating the same | Masaharu Yoshida | 1997-02-25 |
| 5500502 | Bonding method and apparatus | Manabu Horita, Masaharu Yoshida | 1996-03-19 |
| 5305944 | Bonding method and bonding apparatus | Masaharu Yoshida, Yasufumi Nakasu | 1994-04-26 |
| 5220196 | Semiconductor device | Kazunari Michii, Haruo Shimamoto | 1993-06-15 |
| 5105261 | Semiconductor device package having particular lead structure for mounting multiple circuit boards | Tetsuya Ueda, Toru Tachikawa | 1992-04-14 |
| 5067005 | Semiconductor device | Kazunari Michii | 1991-11-19 |
| 5025307 | Modular semiconductor device | Tetsuya Ueda, Toru Tachikawa | 1991-06-18 |