Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7348191 | Semiconductor device with terminals, and method of manufacturing the same | Naoyuki Shinonaga, Shinji Semba | 2008-03-25 |
| 7166490 | Semiconductor device with terminals, and method of manufacturing the same | Naoyuki Shinonaga, Shinji Semba | 2007-01-23 |
| 6858938 | Semiconductor device | — | 2005-02-22 |
| 6836007 | Semiconductor package including stacked semiconductor chips | Jun Shibata | 2004-12-28 |
| 6836004 | Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame | Naoyuki Shinonaga, Shinji Semba | 2004-12-28 |
| 6798056 | Semiconductor module having an upper layer semiconductor package overlying a lower layer semiconductor package | Tetsuya Matsuura, Yasushi Kasatani | 2004-09-28 |
| 6737733 | Sealed semiconductor device and lead frame used for the same | Kazuyuki Misumi, Yoshihiro Hirata | 2004-05-18 |
| 6670701 | Semiconductor module and electronic component | Tetsuya Matsuura, Yasushi Kasatani, Hajime Maeda | 2003-12-30 |
| 6614101 | Lead frame with raised leads and plastic packaged semiconductor device using the same | Kazuyuki Misumi, Manabu Horita | 2003-09-02 |
| 6583511 | Semiconductor device and a method of producing the same | Tatsuhiko Akiyama | 2003-06-24 |
| D475981 | Integrated circuits substrate | — | 2003-06-17 |
| 6552418 | Resin-encapsulated semiconductor device | Kazuyuki Misumi | 2003-04-22 |
| 6545366 | Multiple chip package semiconductor device | Tatsuhiko Akiyama | 2003-04-08 |
| 6518652 | Semiconductor package | Yasuki Takata, Hiroshi Horibe | 2003-02-11 |
| 6445064 | Semiconductor device | Hideki Ishii, Jun Shibata, Moriyoshi Nakashima | 2002-09-03 |
| 6353265 | Semiconductor device | — | 2002-03-05 |
| 6323545 | Semiconductor device | — | 2001-11-27 |
| RE36077 | Method of manufacturing inversion type IC's and IC module using same | Hiroshi Seki | 1999-02-02 |
| RE35496 | Semiconductor device and method of producing the same | Ken Yamamura, Naoto Ueda, Hitoshi Fujimoto, Kiyoaki Tsumura, Hitoshi Sasaki +1 more | 1997-04-29 |
| 5508232 | Method of manufacturing a semiconductor device | Tetsuya Ueda, Yutaka Koyama, Naoto Ueda | 1996-04-16 |
| 5424577 | Lead frame for semiconductor device | Yasuhito Suzuki | 1995-06-13 |
| 5373188 | Packaged semiconductor device including multiple semiconductor chips and cross-over lead | Koichi Nakagawa | 1994-12-13 |
| 5334803 | Semiconductor device and method of producing the same | Ken Yamamura, Naoto Ueda, Hitoshi Fujimoto, Kiyoaki Tsumura, Hitoshi Sasaki +1 more | 1994-08-02 |
| 5303120 | Method of manufacturing inversion type IC's and IC module using same | Hiroshi Seki | 1994-04-12 |
| 5252853 | Packaged semiconductor device having tab tape and particular power distribution lead structure | — | 1993-10-12 |