Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6861370 | Bump formation method | — | 2005-03-01 |
| 6798056 | Semiconductor module having an upper layer semiconductor package overlying a lower layer semiconductor package | Tetsuya Matsuura, Kazunari Michii | 2004-09-28 |
| 6717275 | Semiconductor module | Tetsuya Matsuura, Tadashi Ichimasa | 2004-04-06 |
| 6670701 | Semiconductor module and electronic component | Tetsuya Matsuura, Kazunari Michii, Hajime Maeda | 2003-12-30 |
| 6617695 | Semiconductor device and semiconductor module using the same | — | 2003-09-09 |
| 6590286 | Land grid array semiconductor device | Makio Okada, Tomoaki Hashimoto | 2003-07-08 |
| 6492714 | Semiconductor device and semiconductor module | — | 2002-12-10 |
| 5363274 | Memory card | Makoto Omori, Jun Ohbuchi, Hajime Maeda | 1994-11-08 |
| 5306541 | Printed circuit board and terminal board with staggered conductive pads | — | 1994-04-26 |
| 5024605 | Connecting electrode | Toru Tachikawa | 1991-06-18 |
| 4868714 | IC card including enclosed sliding shutter | Toshinobu Banjo, Yasuhiro Murasawa, Shigeo Onoda | 1989-09-19 |
| 4864116 | Mechanism for connecting an IC card to an external device | Toshinobu Banjo, Tetsuya Ueda, Shigeo Onoda | 1989-09-05 |
| 4838804 | Mechanism for connecting IC card and external device | Toshinobu Banjo, Tetsuya Ueda, Shigeo Onoda | 1989-06-13 |