Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978420 | Semiconductor chip mounting apparatus and semiconductor chip mounting method | Yoshihito Hagiwara, Tomonori Nakamura | 2021-04-13 |
| 9368463 | Semiconductor device | Shiko Shin, Takayuki Saito | 2016-06-14 |
| 9230937 | Semiconductor device and a manufacturing method thereof | Kaori Sumitomo, Hideyuki Arakawa, Yasuki Takata | 2016-01-05 |
| 9230930 | Semiconductor device | Shiko Shin, Takayuki Saito | 2016-01-05 |
| 8686573 | Semiconductor device | Shiko Shin, Takayuki Saito | 2014-04-01 |
| 8415245 | Method of manufacturing semiconductor device and semiconductor device | Yasuki Takata, Kaori Sumitomo, Hideyuki Arakawa | 2013-04-09 |
| 7202565 | Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same | Masazumi Matsuura, Susumu Matsumoto, Tsuyoshi Hamatani | 2007-04-10 |
| 7138725 | Semiconductor device | — | 2006-11-21 |
| 6787927 | Semiconductor device and wire bonding apparatus | — | 2004-09-07 |
| 6600218 | Semiconductor device | Fumiaki Aga, Namiki Moriga, Yasuhito Suzuki, Akira Takaki | 2003-07-29 |
| 6518652 | Semiconductor package | Yasuki Takata, Kazunari Michii | 2003-02-11 |
| 6112969 | Wire bonding apparatus | Kazuko Nakamura, Shinji Toyosaki | 2000-09-05 |
| 6105848 | Wire bonding method, wire bonding apparatus and semiconductor device produced by the same | Kazuko Nakamura, Shinji Toyosaki | 2000-08-22 |
| 5838071 | Wire bonding method, wire bonding apparatus and semiconductor device produced by the same | Kazuko Nakamura, Shinji Toyosaki | 1998-11-17 |