Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11512411 | PTFE sheet and method for mounting die | Osamu Watanabe, Tomonori Nakamura, Yuji Kanai | 2022-11-29 |
| 11189594 | Bonding apparatus and bonding method | Osamu Watanabe, Tomonori Nakamura | 2021-11-30 |
| 11069651 | Method of mounting die | Osamu Watanabe, Tomonori Nakamura, Yuji Kanai | 2021-07-20 |
| 10978420 | Semiconductor chip mounting apparatus and semiconductor chip mounting method | Tomonori Nakamura, Hiroshi Horibe | 2021-04-13 |
| 10566307 | Manufacturing method of semiconductor device | Yuu Hasegawa, Naoki Sekine | 2020-02-18 |
| 10410992 | Ball forming device, wire-bonding apparatus, and ball formation method | Kazumasa Sasakura, Tatsuyuki Sunada | 2019-09-10 |
| 9922952 | Method for producing semiconductor device, and wire-bonding apparatus | Nobuo Takahashi | 2018-03-20 |
| 9337166 | Wire bonding apparatus and bonding method | Naoki Sekine, Koichi Takahashi, Yasuo Nagashima, Motoki Nakazawa | 2016-05-10 |